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Engineer @ Samsung's H1B Salary all years

42 records was found, Median Salary is $131040. 0 percents of the salary are above $200K, 14 percents of the salary are between $150K and $200K, 83 percents of the salary are between $100K and $150K, 2 percents of the salary are less than $100k



<100k2.3809523809524% Complete (success)
100k-150k83.333333333333% Complete (success)
150k-200k14.285714285714% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
SAMSUNG ELECTRONICS AMERICA INCENGINEER 2, SOFTWARE QUALITY ENGINEERING140,000BELLEVUE, WA06/09/202207/18/2022
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, ANDROID APPLICATION105,000BELLEVUE, WA03/07/201909/01/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, SOFTWARE PROCESS ENGINEERING84,000BELLEVUE, WA04/06/201804/09/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, SOFTWARE PROJECT MANAGEMENT115,000BELLEVUE, WA03/06/202003/30/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, SOFTWARE PROJECT MANAGEMENT118,000BELLEVUE, WA09/19/201909/27/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, MACHINE LEARNING100,000BELLEVUE, WA05/05/202110/01/2021
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE ANALYSIS ENGINEERING120,000BELLEVUE, WA04/16/201804/30/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING120,000BELLEVUE, WA03/05/201909/02/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING120,000BELLEVUE, WA11/16/202101/03/2022
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING127,338BELLEVUE, WA12/29/202201/23/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING130,000BELLEVUE, WA08/02/201908/08/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING139,650BELLEVUE, WA04/09/202010/01/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING140,000BELLEVUE, WA05/04/202010/01/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING148,013BELLEVUE, WA09/21/202211/14/2022
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING148,013BELLEVUE, WA10/19/202201/04/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING148,013BELLEVUE, WA09/21/202211/14/2022
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE QUALITY ENGINEERING125,000BELLEVUE, WA08/09/201808/27/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, BACK-END SERVER140,000BELLEVUE, WA05/29/201906/03/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, NETWORK FRAMEWORK120,000BELLEVUE, WA04/23/201904/29/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEERING148,013BELLEVUE, WA04/21/202306/05/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEERING150,000BELLEVUE, WA05/04/201805/29/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEERING156,000BELLEVUE, WA02/11/202102/24/2021
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROJECT MANAGEMENT150,000BELLEVUE, WA06/20/201807/02/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROJECT MANAGEMENT165,000BELLEVUE, WA01/07/201901/14/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE QUALITY ENGINEERING140,000BELLEVUE, WA11/28/201812/03/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE QUALITY ENGINEERING145,000BELLEVUE, WA08/31/202012/11/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE QUALITY ENGINEERING145,000BELLEVUE, WA08/31/202012/11/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM PROCESS ENGINEERING145,000BELLEVUE, WA04/15/202205/02/2022
SAMSUNG ELECTRONICS AMERICA INCENGINEER M , SOFTWARE QUALITY ENGINEERING155,000BELLEVUE, WA02/17/202103/05/2021
SAMSUNG ELECTRONICS AMERICA INCENGINEER STAFF I130,000BELLEVUE, WA06/29/201707/31/2017
SAMSUNG ELECTRONICS AMERICA INCENGINEER STAFF I137,402BELLEVUE, WA03/23/201704/10/2017
SAMSUNG ELECTRONICS AMERICA INCENGINEER, ANDROID APPLICATION170,339BELLEVUE, WA09/16/201902/01/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER, SOFTWARE PROCESS ENGINEERING115,000BELLEVUE, WA07/21/202008/17/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER, SOFTWARE PROCESS ENGINEERING115,000BELLEVUE, WA03/05/201909/02/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER, SOFTWARE PROCESS ENGINEERING115,000BELLEVUE, WA03/05/201909/02/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER, SOFTWARE PROCESS ENGINEERING115,000BELLEVUE, WA07/21/202008/17/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER, SOFTWARE PROCESS ENGINEERING132,080BELLEVUE, WA03/09/201803/14/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER, SOFTWARE PROCESS ENGINEERING ENGINEER STAFF I123,870BELLEVUE, WA03/27/201809/11/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER, SOFTWARE PRODUCT PROJECT MANAGEMENT140,000BELLEVUE, WA09/07/202209/21/2022
SAMSUNG ELECTRONICS AMERICA INCENGINEER, SOFTWARE QUALITY ENGINEERING102,000BELLEVUE, WA08/21/201809/03/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER, SYSTEM EVALUATION106,600BELLEVUE, WA03/16/202109/03/2021
SAMSUNG ELECTRONICS AMERICA INCENGINEER, SYSTEM EVALUATION107,000BELLEVUE, WA12/22/202001/11/2021

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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