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Engineer I @ Samsung's H1B Salary 2019

34 records was found, Median Salary is $130000. 0 percents of the salary are above $200K, 15 percents of the salary are between $150K and $200K, 68 percents of the salary are between $100K and $150K, 18 percents of the salary are less than $100k



<100k17.647058823529% Complete (success)
100k-150k67.647058823529% Complete (success)
150k-200k14.705882352941% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, ANDROID APPLICATION105,000BELLEVUE, WA03/07/201909/01/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, SOFTWARE PROJECT MANAGEMENT118,000BELLEVUE, WA09/19/201909/27/2019
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II84,400AUSTIN, TX05/21/201908/22/2019
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II84,400AUSTIN, TX06/03/201908/22/2019
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II85,400AUSTIN, TX05/01/201908/27/2019
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II87,500AUSTIN, TX05/20/201906/03/2019
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II97,000AUSTIN, TX05/15/201908/16/2019
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II97,900AUSTIN, TX05/15/201908/16/2019
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II100,000AUSTIN, TX10/28/201911/04/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, APPLICATION FRAMEWORK136,440BERKELEY HEIGHTS, NJ11/11/201904/03/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, DATA ENGINEERING130,000MOUNTAIN VIEW, CA03/11/201909/07/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE ANALYSIS ENGINEERING108,531RICHARDSON, TX01/30/201903/15/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE ANALYSIS ENGINEERING108,531RICHARDSON, TX01/30/201903/15/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE ANALYSIS ENGINEERING118,000PLANO, TX08/05/201908/15/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE ANALYSIS ENGINEERING120,000PLANO, TX08/05/201908/15/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING110,000PLANO, TX06/06/201906/24/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING120,000BELLEVUE, WA03/05/201909/02/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING130,000BELLEVUE, WA08/02/201908/08/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING140,000MOUNTAIN VIEW, CA08/01/201908/07/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SYSTEM STRUCTURE DESIGN142,000MOUNTAIN VIEW, CA06/10/201906/24/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, ANDROID APPLICATION141,214BERKELEY HEIGHTS, NJ02/08/201908/01/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, BACK-END SERVER140,000BELLEVUE, WA05/29/201906/03/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, DATA ENGINEERING130,000PLANO, TX10/24/201911/11/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, DATA ENGINEERING173,000MOUNTAIN VIEW, CA10/09/201910/21/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, NETWORK FRAMEWORK120,000BELLEVUE, WA04/23/201904/29/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING130,000PLANO, TX10/09/201910/21/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING130,000PLANO, TX12/05/201901/13/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEER165,000MOUNTAIN VIEW, CA05/09/201905/29/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEER165,000MOUNTAIN VIEW, CA05/15/201905/29/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEERING160,000MOUNTAIN VIEW, CA11/08/201911/18/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROJECT MANAGEMENT165,000BELLEVUE, WA01/07/201901/14/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM STRUCTURE DESIGN130,000PLANO, TX08/23/201909/30/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM STRUCTURE DESIGN130,000PLANO, TX07/31/201908/08/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM STRUCTURE DESIGN130,000PLANO, TX09/11/201909/30/2019

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

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