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Engineer I @ Samsung's H1B Salary 2020

43 records was found, Median Salary is $130000. 0 percents of the salary are above $200K, 12 percents of the salary are between $150K and $200K, 84 percents of the salary are between $100K and $150K, 5 percents of the salary are less than $100k



<100k4.6511627906977% Complete (success)
100k-150k83.720930232558% Complete (success)
150k-200k11.627906976744% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, NETWORK FRAMEWORK107,681PLANO, TX02/21/202007/28/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, NETWORK FRAMEWORK107,681PLANO, TX02/21/202007/28/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, SOFTWARE ANALYSIS ENGINEERING98,000PLANO, TX01/15/202004/02/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, SOFTWARE ANALYSIS ENGINEERING122,400PLANO, TX07/08/202012/21/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER I, SOFTWARE PROJECT MANAGEMENT115,000BELLEVUE, WA03/06/202003/30/2020
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II86,800AUSTIN, TX01/13/202007/06/2020
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II107,827AUSTIN, TX03/09/202008/11/2020
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II119,581AUSTIN, TX04/07/202007/29/2020
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II119,851AUSTIN, TX03/09/202008/08/2020
SAMSUNG AUSTIN SEMICONDUCTOR LLCENGINEER II138,000SAN JOSE, CA02/03/202008/04/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, APPLICATION FRAMEWORK116,148BERKELEY HEIGHTS, NJ06/24/202012/04/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, APPLICATION FRAMEWORK116,148BERKELEY HEIGHTS, NJ06/24/202012/04/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, DATA ENGINEERING115,000PLANO, TX01/06/202001/27/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, DATA ENGINEERING115,000PLANO, TX01/06/202001/27/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, NETWORK FRAMEWORK131,841BERKELEY HEIGHTS, NJ02/06/202007/24/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE ANALYSIS118,000PLANO, TX05/28/202007/13/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE ANALYSIS ENGINEERING110,000PLANO, TX12/15/202001/25/2021
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE ANALYSIS ENGINEERING110,000PLANO, TX12/15/202001/25/2021
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE ANALYSIS ENGINEERING110,000PLANO, TX05/21/202008/03/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING139,650BELLEVUE, WA04/09/202010/01/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING140,000BELLEVUE, WA05/04/202010/01/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING165,000MOUNTAIN VIEW, CA04/29/202010/01/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SYSTEMS STRUCTURE DESIGN120,000PLANO, TX07/06/202008/03/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, MACHINE LEARNING145,000RIDGEFIELD PARK, NJ07/29/202008/24/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, PLATFORM ARCHITECTURE160,000MOUNTAIN VIEW, CA02/03/202002/24/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING115,000PLANO, TX07/08/202008/10/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING130,000PLANO, TX06/01/202008/03/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING130,000PLANO, TX06/01/202008/03/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING130,000PLANO, TX07/15/202008/17/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING130,000PLANO, TX07/15/202008/17/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING135,000REDMOND, WA06/01/202007/13/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING142,000PLANO, TX11/17/202012/14/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING142,000PLANO, TX11/17/202012/14/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEERING175,000MOUNTAIN VIEW, CA02/24/202003/02/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEERING175,000MOUNTAIN VIEW, CA02/24/202003/02/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE QUALITY ENGINEERING145,000BELLEVUE, WA08/31/202012/11/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE QUALITY ENGINEERING145,000BELLEVUE, WA08/31/202012/11/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM STRUCTURE DESIGN130,000PLANO, TX10/02/202011/09/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM STRUCTURE DESIGN145,000PLANO, TX07/07/202007/20/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM STRUCTURE DESIGN150,000HERNDON, VA12/11/202002/15/2021
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEMS STRUCTURE DESIGN140,000PLANO, TX10/02/202010/19/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEMS STRUCTURE DESIGN140,000PLANO, TX09/28/202010/19/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEMS STRUCTURE DESIGN144,000PLANO, TX10/01/202011/09/2020

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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