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Vice President, Software Engineering's H1B Salary 2020

18 records was found, Median Salary is $131050. 0 percents of the salary are above $200K, 6 percents of the salary are between $150K and $200K, 94 percents of the salary are between $100K and $150K, 0 percents of the salary are less than $100k



<100k0% Complete (success)
100k-150k94.444444444444% Complete (success)
150k-200k5.5555555555556% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING112,000COLUMBUS, OH02/19/202006/24/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING112,000COLUMBUS, OH06/29/202009/11/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING112,000COLUMBUS, OH07/01/202011/02/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING114,900COLUMBUS, OH10/05/202002/10/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING121,000COLUMBUS, OH07/07/202012/30/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING125,000COLUMBUS, OH02/12/202002/26/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING126,072COLUMBUS, OH01/16/202006/07/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING129,300COLUMBUS, OH11/24/202004/16/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING131,000COLUMBUS, OH06/12/202012/01/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING131,100COLUMBUS, OH03/18/202008/22/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING132,700COLUMBUS, OH06/16/202011/20/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING133,000COLUMBUS, OH07/22/202001/01/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING134,300COLUMBUS, OH09/07/202001/13/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING135,000COLUMBUS, OH12/04/202001/14/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING135,000COLUMBUS, OH02/12/202003/23/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING135,700COLUMBUS, OH03/06/202007/02/2020
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING136,100COLUMBUS, OH11/03/202001/28/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING151,250COLUMBUS, OH05/28/202007/01/2020

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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