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Hardware Development Engineer Ii's H1B Salary 2023

20 records was found, Median Salary is $128250. 0 percents of the salary are above $200K, 20 percents of the salary are between $150K and $200K, 55 percents of the salary are between $100K and $150K, 25 percents of the salary are less than $100k



<100k25% Complete (success)
100k-150k55% Complete (success)
150k-200k20% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
AMAZON DATA SERVICES INCHARDWARE DEVELOPMENT ENGINEER II73,923SEATTLE, WA01/19/202307/18/2023
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II98,821SEATTLE, WA04/20/202310/16/2023
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II98,821SEATTLE, WA06/12/202306/17/2023
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II98,821SEATTLE, WA01/19/202307/18/2023
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II98,821SEATTLE, WA02/23/202308/19/2023
AMAZON DATA SERVICES INCHARDWARE DEVELOPMENT ENGINEER II103,958SEATTLE, WA09/19/202303/16/2024
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II103,958SEATTLE, WA08/03/202301/30/2024
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II103,958SEATTLE, WA11/07/202311/13/2023
AMAZON WEB SERVICES INCHARDWARE DEVELOPMENT ENGINEER II103,958SEATTLE, WA07/28/202301/24/2024
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II120,300SEATTLE, WA11/28/202305/26/2024
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II136,200SEATTLE, WA02/07/202308/06/2023
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II137,500SEATTLE, WA11/01/202304/27/2024
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II142,900SEATTLE, WA01/20/202301/25/2023
AMAZON DATA SERVICES INCHARDWARE DEVELOPMENT ENGINEER II143,800SEATTLE, WA09/29/202303/27/2024
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II146,200SEATTLE, WA08/04/202310/01/2023
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II146,438SEATTLE, WA03/07/202309/02/2023
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II152,000SEATTLE, WA02/16/202308/15/2023
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II153,600SEATTLE, WA10/04/202303/30/2024
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II155,251SEATTLE, WA06/21/202312/16/2023
AMAZONCOM SERVICES LLCHARDWARE DEVELOPMENT ENGINEER II156,800SEATTLE, WA10/06/202303/05/2024

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Mar 2024
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