Search Salary Now

Trending now: Meta, Amazon, Apple, Netflix, Google, Airbnb, Uber, Linkedin, Salesforce

R&d Engineer Firmware @ Broadcom Corporation's H1B Salary 2022

6 records was found, Median Salary is $149854. 0 percents of the salary are above $200K, 50 percents of the salary are between $150K and $200K, 50 percents of the salary are between $100K and $150K, 0 percents of the salary are less than $100k



<100k0% Complete (success)
100k-150k50% Complete (success)
150k-200k50% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE127,221ANDOVER, MA05/25/202210/01/2022
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE146,468SAN JOSE, CA02/16/202207/02/2022
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE149,708SAN JOSE, CA08/23/202202/15/2023
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE150,000AUSTIN, TX04/11/202204/15/2022
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE155,186SAN JOSE, CA05/02/202210/01/2022
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE170,566SAN JOSE, CA03/11/202207/02/2022

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
Copyright @ h1bdata.info. All rights reserved.
Contact us     Privacy policy     Advertise