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Electrical Hardware Engineer @ Hp Inc's H1B Salary 2023

27 records was found, Median Salary is $94266. 0 percents of the salary are above $200K, 0 percents of the salary are between $150K and $200K, 37 percents of the salary are between $100K and $150K, 63 percents of the salary are less than $100k



<100k62.962962962963% Complete (success)
100k-150k37.037037037037% Complete (success)
150k-200k0% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
HP INCELECTRICAL HARDWARE ENGINEER65,958CORVALLIS, OR03/06/202009/05/2020
HP INCELECTRICAL HARDWARE ENGINEER79,955CORVALLIS, OR03/23/201909/10/2019
HP INCELECTRICAL HARDWARE ENGINEER79,995CORVALLIS, OR03/22/201909/10/2019
HP INCELECTRICAL HARDWARE ENGINEER83,117CORVALLIS, OR02/14/201706/24/2017
HP INCELECTRICAL HARDWARE ENGINEER86,448CORVALLIS, OR06/11/202110/01/2021
HP INCELECTRICAL HARDWARE ENGINEER88,109CORVALLIS, OR04/15/201908/12/2019
HP INCELECTRICAL HARDWARE ENGINEER88,109CORVALLIS, OR03/18/201909/10/2019
HP INCELECTRICAL HARDWARE ENGINEER88,109CORVALLIS, TX10/10/201810/15/2018
HP INCELECTRICAL HARDWARE ENGINEER88,109CORVALLIS, OR10/30/201811/05/2018
HP INCELECTRICAL HARDWARE ENGINEER90,000CORVALLIS, OR03/12/202103/29/2021
HP INCELECTRICAL HARDWARE ENGINEER90,272CORVALLIS, OR02/19/201608/11/2016
HP INCELECTRICAL HARDWARE ENGINEER92,539CORVALLIS, OR03/11/202008/08/2020
HP INCELECTRICAL HARDWARE ENGINEER92,539CORVALLIS, OR01/09/202006/25/2020
HP INCELECTRICAL HARDWARE ENGINEER94,266CORVALLIS, OR03/17/202208/13/2022
HP INCELECTRICAL HARDWARE ENGINEER96,242CORVALLIS, OR10/16/201810/22/2018
HP INCELECTRICAL HARDWARE ENGINEER96,387CORVALLIS, OR03/07/202308/23/2023
HP INCELECTRICAL HARDWARE ENGINEER97,448CORVALLIS, OR08/04/202310/01/2023
HP INCELECTRICAL HARDWARE ENGINEER102,024CORVALLIS, OR01/23/202307/13/2023
HP INCELECTRICAL HARDWARE ENGINEER102,024CORVALLIS, OR01/23/202307/17/2023
HP INCELECTRICAL HARDWARE ENGINEER102,024CORVALLIS, OR01/25/202307/20/2023
HP INCELECTRICAL HARDWARE ENGINEER102,159CORVALLIS, OR03/25/202009/04/2020
HP INCELECTRICAL HARDWARE ENGINEER102,159CORVALLIS, OR09/15/202010/01/2020
HP INCELECTRICAL HARDWARE ENGINEER103,085CORVALLIS, OR02/27/202008/10/2020
HP INCELECTRICAL HARDWARE ENGINEER103,530CORVALLIS, OR06/25/202107/10/2021
HP INCELECTRICAL HARDWARE ENGINEER104,978CORVALLIS, OR04/22/202109/15/2021
HP INCELECTRICAL HARDWARE ENGINEER106,508CORVALLIS, OR06/25/202111/06/2021
HP INCELECTRICAL HARDWARE ENGINEER107,350CORVALLIS, OR06/18/202111/05/2021

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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